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this is information on a product in full production. march 2012 doc id022576 rev 3 1/26 26 VNI4140K-32 quad high side smart power solid state relay datasheet ? production data features output current: 1 a per channel shorted load protections junction overtemperature protection case overtemperature protection for thermal independence of the channels thermal case shutdown restart not simultaneous for the various channels protection against loss of ground current limitation undervoltage shutdown open drain diagnostic outputs 3.3 v cmos/ttl compatible inputs fast demagnetization of inductive loads conforms to iec 61131-2 esd according to iec 61000-4-2 up to +/- 25 kv description the VNI4140K-32 is a monolithic device made using stmicroelectronics vipower technology, intended for driving four independent resistive, capacitive or inductive loads with one side connected to ground. active current limitation avoids the system power supply dropping in the case of shorted load. built-in thermal shutdown protects the chip from overtemperature and short- circuit. in overload condition, the channel turns off and back on automatically so as to maintain junction temperature between t tsd and t r . if this condition causes case temperature to reach t csd , the overloaded channel is turned off and restarts only when case temperature has decreased down to t cr . in the case of more than one channel in overload, re-start of the overloaded channels is not simultaneous, in order to avoid high peak current from the supply. non- overloaded channels continue to operate normally. the open drain diagnostic outputs indicate overtemperature conditions. figure 1. block diagram type v demag (1) 1. per channel r dson (1) i out (1) v cc VNI4140K-32 v cc -41 v 0.08 ? 1 a 41 v powersso-24 www.st.com
contents VNI4140K-32 2/26 doc id022576 rev 3 contents 1 pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 recommended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 thermal management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7 switching waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 9 package and pcb thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.1 VNI4140K-32 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 10 reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 11 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 12 ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 13 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
VNI4140K-32 pin connection doc id022576 rev 3 3/26 1 pin connection figure 2. pin connection (top view) table 1. pin description pin name description tab tab exposed tab internally connected to vcc 1 vcc supply voltage 2 in1 channel 1 input 3.3 v cmos/ttl compatible 3 stat1 channel 1 status in open drain configuration 4 in2 channel 2 input 3.3 v cmos/ttl compatible 5 sta2 channel 2 status in open drain configuration 6 gnd device ground connection 7 stat3 channel 3 status in open drain configuration 8 in3 channel 3 input 3.3 v cmos/ttl compatible 9 stat4 channel 4 status in open drain configuration 10 in4 channel 4 input 3.3 v cmos/ttl compatible 11 nc 12 nc 13 out4 channel 4 power stage output, internally protected 14 out4 channel 4 power stage output, internally protected 15 out4 channel 4 power stage output, internally protected 16 out3 channel 3 power stage output, internally protected 17 out3 channel 3 power stage output, internally protected out1 out1 out1 out2 out2 out2 v cc in1 stat1 in2 stat2 gnd out3 out3 out3 out4 out4 out4 stat3 in3 stat4 nc nc in4
pin connection VNI4140K-32 4/26 doc id022576 rev 3 pin name description 18 out3 channel 3 power stage output, internally protected 19 out2 channel 2 power stage output, internally protected 20 out2 channel 2 power stage output, internally protected 21 out2 channel 2 power stage output, internally protected 22 out1 channel 1 power stage output, internally protected 23 out1 channel 1 power stage output, internally protected 24 out1 channel 1 power stage output, internally protected table 1. pin description (continued)
VNI4140K-32 maximum ratings doc id022576 rev 3 5/26 2 maximum ratings 2.1 thermal data 3 recommended table 2. absolute maximum rating symbol parameter value unit v cc power supply voltage 41 v -v cc reverse supply voltage -0.3 v i gnd dc ground reverse current -250 ma i out output current (continuos) internally limited a i r reverse output current (per channel) -5 a i in input current (per channel) 10 ma v in input voltage +v cc v v stat status pin voltage +v cc v i stat status pin current 10 ma v esd electrostatic discharge (r = 1.5 k ? ; c = 100 pf) 2000 v e as single pulse avalanche energy per channel not simultaneous 300 mj p tot power dissipation at t c = 25 c internally limited w t j junction operating temperature internally limited c t stg storage temperature -55 to 150 c table 3. thermal data symbol parameter value unit r th(jc) thermal resistance junction-case (1) 1. per channel. max. 2 c/w r th(ja) thermal resistance junction-ambient max. see figure 11 c/w table 4. input switching limits symbol parameter value unit f vin max maximum input switching frequency 10 khz
electrical characteristics VNI4140K-32 6/26 doc id022576 rev 3 4 electrical characteristics 10.5 v < v cc < 36 v; -40 c < t j < 125 c; unless otherwise specified. v cc = 24 v; -25 c < t j < 125 c, r l = 48 ? , input rise time < 0.1 s) table 5. power section symbol parameter test condition min. typ. max. unit vcc supply voltage 10.5 36 v r ds(on) on state resistance i out = 0.7 a at t j = 25 c i out = 0.7 a 0.080 0.140 ? ? v clamp i s = 20 ma 41 45 52 v i s supply current all channels in off state, on state with v in = 5 v 250 2.4 4 a ma v out(off) off state output voltage v in = 0 v and i out = 0 a 1 v i out(off) off state output current v in = v out = 0 v 0 5 a i lgnd output current in ground disconnection v cc = v in = gnd = 24 v; t j = 125 c 500 a f cp charge pump frequency channel in on state (1) 1. to cover en55022 class a and class b normative. 1450 khz table 6. switching symbol parameter test condition min. typ. max. unit t d (on) tu r n o n d e l ay 6 s t r rise time 5 s t d (off) turn off 12 s t f fall time 5 s dv/dt (on) turn on voltage slope 4 v/s dv/dt (off) turn off voltage slope 4v/s
VNI4140K-32 electrical characteristics doc id022576 rev 3 7/26 figure 3. switching parameter conventions d 6 d 4 nt rise t fall tf tr d6/. d6/&& 6out t t d /. t d /&& td/. td/&& t 6in 6out t
electrical characteristics VNI4140K-32 8/26 doc id022576 rev 3 table 7. logical input symbol parameter test conditions min. typ. max. unit v il input low level voltage 0.8 v v ih input high level voltage 2.20 v v i(hyst) input hysteresis voltage 0.15 v i in input current v in = 15 v 10 ? v in = 36 v 210 table 8. protection and diagnostic symbol parameter test conditions min. typ. max. unit v stat status voltage output low i stat = 1.6 ma 0.6 v v usd undervoltage protection 710.5v v usdhys undervoltage hysteresis 0.4 0.5 v i lim dc short-circuit current v cc = 24 v; r load < 10 m ? 1.01 2.6 a i peak maximum dc output current dynamic load 1.6 a i lstat status leakage current v cc = v stat = 36 v 30 ? t tsd junction shutdown temperature 150 170 190 c t r junction reset temperature 135 c t hist junction thermal hysteresis 715 c t csd case shutdown temperature 125 130 135 c t cr case reset temperature 110 c t chyst case thermal hysteresis 715 c v demag output voltage at turn-off i out = 0.5 a; l load >= 1 mh v cc - 41 v cc - 45 v cc - 52 v
VNI4140K-32 electrical characteristics doc id022576 rev 3 9/26 figure 4. current and voltage conventions
truth table VNI4140K-32 10/26 doc id022576 rev 3 5 truth table table 9. truth table conditions inputn outputn statusn normal operation l h l h h h overtemperature l h l l h l undervoltage l h l l x x shorted load (current limitation before thermal shutdown) l h l x h h
VNI4140K-32 thermal management doc id022576 rev 3 11/26 6 thermal management the power dissipation in the ic is the main factor that sets the safe operating condition of the device in the application. therefore, it must be very carefully considered. furthermore, the available space on the pcb should be chosen considering the power dissipation. heatsinking can be achieved using copper on the pcb with proper area and thickness. two different protections have been implemented to guarantee safety of the device if it overheats due to an overloaded condition or high environment temperature. the following flowchart explains in detail this protection functionality. figure 5. thermal behavior no tj ( i ) > tt s d vi n ( i ) = h out(i) off stat(i) on (l) tc > tc s d no yes no yes tc > tc r yes no tj(i) > tjr yes stat(i) off (h) out(i) on 1) 4) 2) 3)
switching waveforms VNI4140K-32 12/26 doc id022576 rev 3 7 switching waveforms figure 6. switching waveforms
VNI4140K-32 pin functions doc id022576 rev 3 13/26 8 pin functions figure 7. input circuit figure 8. status circuit
pin functions VNI4140K-32 14/26 doc id022576 rev 3 figure 9. charge pump switching frequency (typical) vs. temperature freq_cp 800 1000 1200 1400 1600 1800 2000 -50 0 50 100 150 200 temperature("c) cp_frequency (khz) freq_cp
VNI4140K-32 package and pcb thermal data doc id022576 rev 3 15/26 9 package and pcb thermal data 9.1 VNI4140K-32 thermal data figure 10. VNI4140K-32 pcb note: layout condition of r th and z th measurements (pcb: double layer, thermal vias, fr4 area = 77 mm x 86 mm, pcb thickness=1.6 mm, cu thickness = 70 mm (front and back side), copper areas: from minimum pad layout to 8 cm 2 ). figure 11. r thja vs. pcb copper area in open box free air condition (one channel on)
package and pcb thermal data VNI4140K-32 16/26 doc id022576 rev 3 figure 12. VNI4140K-32 thermal impedance junction ambient single pulse (one channel on)
VNI4140K-32 reverse polarity protection doc id022576 rev 3 17/26 10 reverse polarity protection this schematic can be used with any type of load. the following is an indication on how to dimension the r gnd resistor. r gnd = (-v cc ) / (-i gnd ) where -i gnd is the dc reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. power dissipation in r gnd (when v cc < 0: during reverse polarity situations) is: pd = (-v cc ) 2 /r gnd note: in normal conditions (no reverse polarity) due to the diode there is a voltage drop between gnd of the device and gnd of the system. figure 13. reverse polarity protection status i input i gnd output i + vcc r gnd load diode status i input i gnd output i + vcc r gnd load diode
package mechanical data VNI4140K-32 18/26 doc id022576 rev 3 11 package mechanical data in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark.
VNI4140K-32 package mechanical data doc id022576 rev 3 19/26 figure 14. powersso-24 package dimensions table 10. powersso-24 mechanical data symbol mm min. typ. max. a 2.15 2.47 a2 2.15 2.40 a1 0 0.075 b 0.33 0.51 c 0.23 0.32 d 10.10 10.50 e 7.4 7.6 e 0.8 e3 8.8 g 0.1 g1 0.06 h 10.1 10.5 h 0.4 l 0.55 0.85 n 10deg x 4.1 4.7 y 6.5 7.1
package mechanical data VNI4140K-32 20/26 doc id022576 rev 3 figure 15. powersso-24 tube shipment (no suffix) note: all dimensions are in mm. table 11. powersso-24 tube shipment base q.ty 49 bulk q.ty 1225 tube length ( 0.5) 532 a 3.5 b 13.8 c ( 0.1) 0.6
VNI4140K-32 package mechanical data doc id022576 rev 3 21/26 figure 16. powersso-24 reel shipment (suffix ?tr?) table 12. powersso-24 reel dimensions base q.ty 1000 bulk q.ty 1000 a (max.) 330 b (min.) 1.5 c ( 0.2) 13 f 20.2 g (2 0) 24.4 n (min.) 100 t (max.) 30.4
package mechanical data VNI4140K-32 22/26 doc id022576 rev 3 figure 17. powersso-24 tape dimensions note: according to the electronic industries association (eia) standard 481 rev. a, feb 1986. table 13. powersso-24 tape dimensions tape width w 24 tape hole spacing p0 ( 0.1) 4 component spacing p 12 hole diameter d ( 0.05) 1.55 hole diameter d1 (min) 1.5 hole position f ( 0.1) 11.5 compartment depth k (max) 2.85 hole spacing p1 ( 0.1) 2
VNI4140K-32 package mechanical data doc id022576 rev 3 23/26 figure 18. VNI4140K-32 suggested footprint note: stmicroelectronics is not responsible for any pcb related issues. the footprint shown in the above figure is a suggestion which might not be in line to the customer pcb supplier design rules. all dimensions are in mm. 3older-ask/pening 2 n
ordering information VNI4140K-32 24/26 doc id022576 rev 3 12 ordering information table 14. ordering information order codes package packaging VNI4140K-32 powersso-24 tube vni4140ktr-32 powersso-24 tape and reel
VNI4140K-32 revision history doc id022576 rev 3 25/26 13 revision history table 15. document revision history date revision changes 12-dec-2011 1 initial release. 06-feb-2012 2 updated i lim minimum value in table 8: protection and diagnostic . inserted new feature: esd according to iec 61000-4-2 up to +/-25 kv, in cover page. 07-mar-2012 3 suggested footprint inserted. in table 5. parameter i lgnd has been added.
VNI4140K-32 26/26 doc id022576 rev 3 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by two authorized st representatives, st products are not recommended, authorized or warranted for use in military, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2012 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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